HY is Stamping Selective Plated Lead Frames manufacturers and suppliers in China who can wholesale Stamping Selective Plated Lead Frames, we can provide professional service and better price for you.

Selectively plated lead frames are used in the semiconductor device assembly process and are essentially a thin layer of metal used to connect tiny electrical terminals on the surface of a semiconductor to large-scale circuits on electrical devices and circuit boards.

Selective Plating Lead Frames Lead frames are used in nearly all semiconductor packages. Most types of integrated circuit packages are made by placing a silicon chip on a leadframe, then wirebonding the chip to the metal leads of that leadframe, and then covering the chip with plastic. This simple and often low-cost package remains the best solution for many applications.

Typically, leadframes are produced in long strips, which allows them to be processed quickly on assembly machines, and are often stamped using progressive high speed stamping die.

Main features of HY factory production：

1. Metal plate based connector terminal pins

2. Plug-in contacts, spring contacts and custom interconnect lead frames

3. Complex part geometries with maximum accuracy

4. Patented compliance crimp zone for solderless assembly

5. Selective plating according to customer needs

6. Pins can be supplied in bulk or in lead frame

7. Cooperate with strong partners in the field of plastic molding of hybrid components

8.100% optical inspection